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Plasmalab®80Plus open-loading plasma etch & deposition tool
A flexible, compact and economical solution for plasma etching and deposition processes. Allowing maximum process flexibility for compound semiconductor, optoelectronics, photonics, MEMS and microfluidics applications, the Plasmalab80Plus can be configured for inductively coupled plasma (ICP) etching and deposition (ICP-PECVD), reactive ion etching (RIE), plasma etching (PE) or plasma enhanced chemical vapour deposition (PECVD). The open load design allows for fast loading and unloading, ideal for prototyping and low volume production environments.
New Plasmalab80Plus/800Plus brochure now available! Click in Downloads and Links to the right, or contact us at plasma.technology@oxinst.com for your copy.
Key features
Processes
Contact us for details in our process performance datasheets, for example:
- Si cryo etch and Bosch deep Si etch for MEMS, microfluidics, Si waveguides, etc
- SiO2, SiNx NH3-free SiNx deposition and etch for hard mask, passivation, etc
- RIE of III-V photonics
- ICP-PECVD for low-temperature deposition of SiO2 and SiNx
We work closely with our customers to develop new and customised processes according to their application needs; please contact us for details.
Plasmalab80Plus compact open-loading system for plasma etching and deposition
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