Plasmalab^®800Plus open-loading plasma etch & deposition tool

Plasmalab®800Plus open-loading plasma etch & deposition tool

A flexible solution for plasma etching and deposition processes on large wafer batches and 300 mm wafers, in a compact footprint, open-loading system. Allowing maximum process flexibility for compound semiconductor, optoelectronics, photonics, applications, the Plasmalab800Plus can be configured for inductively coupled plasma (ICP) etching and deposition (ICP-PECVD), reactive ion etching (RIE), plasma etching (PE) or plasma enhanced chemical vapour deposition (PECVD). The large wafer platen allows for production scale batch processing and 300 mm wafer handling.

New Plasmalab80Plus/800Plus brochure now available! Click in Downloads and Links to the right, or contact us at plasma.technology@oxinst.com for your copy.

Key features

• Up to 40 x 2", 19 x 3", 10 x 4", 2 x 6" or one 8"/200 mm or 12"/300 mm wafer(s) can be loaded.
• Substrate temperature control is provided up to 400 °C.
• Endpoint detection by laser interferometry and/or optical emission spectroscopy can be fitted to the Plasmalab800Plus to enhance etch control.
• Options of a 6- or 12-line gas pod provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool.