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OpAL® – A compact open-load system for Atomic Layer Deposition (ALD)
New product!
Thermal ALD System with Plasma Option
Atomic layer deposition (ALD) offers the opportunity to create precisely controlled ultra-thin films for advanced applications on nanometre and sub-nanometre scales, with conformal coating into high aspect ratio structures. OpAL introduces to the market a unique thermal ALD tool with a clear and easy upgrade route to plasma, allowing the combination of both plasma and thermal ALD in a single compact tool.
Broaden possibilities with the versatile OpAL
The purpose-built OpAL for thermal ALD processing can accommodate small pieces or up to 200 mm wafer (8 inches) for academic and industry R&D compatibility.
Enhance your capabilities with plasma
The remote plasma option allows for the widest possible choice of precursor chemistry with enhanced film quality. Plasma enables low-temperature ALD processes and the remote source maintains low damage.
Thermal and/or plasma chemistries available for:
- Oxides: HfO2, Al2O3, TiO2, SiO2, ZnO, Ta2O5
- Nitrides: TiN, Si3N4
- Metals: Ru, Pt
Save time with process guarantees
Oxford Instruments’ customers benefit from our process guarantees: controllable, repeatable processes developed in our own applications laboratory and backed by onsite process acceptance and support.
Processes are developed in Oxford Instruments’ own application laboratory
- Up to 200 mm wafer with typical uniformity <±2%
- Provides excellent step coverage even inside high aspect ratio structures
- Offers superb thin film barrier properties
- Low carbon contamination of Al2O3 (AES)
- Amorphous, pin-hole free Al2O3 (TEM)
- Excellent uniformity of HfO2, < ±2% on a 200 mm wafer (Spectroscopic Ellipsometry)
Power ahead with intuitive software
Utilising the same software platform as Oxford Instruments’ trusted Plasmalab® product family, the OpAL recipe-driven, multi-user level, PC2000TM control software is easy-to-use and tailored for rapid cycle ALD.
Be reassured with global customer support
Oxford Instruments offers customers global hardware and process support from our worldwide service and support team.
Unique system benefits
- Vapour draw or bubbling of up to four liquid or solid precursors
- Can be fitted with a nitrogen purged glove box with sample entry load lock for dry environment
- Easily detachable liners reduce chamber cleaning times
- In-situ analytical options including spectroscopic ellipsometry linked into ALD control software
Safety features
- Cabinet can be fitted to extraction lines and has nitrogen purge for assured health and safety compliance
- Pneumatic hoist for safe opening of chamber
- Can be fitted with extraction hood or nitrogen purged glove box for health and safety compliance
OpAL compact open-load system for atomic layer deposition (ALD)
Safe yet easy access to precursors in the OpAL ALD system
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Downloads and Links
- OpAL atomic layer deposition product information
(273Kb)
- Atomic Layer Deposition Brochure
(840Kb)
- PlasmalabSystem100Pro Brochure
(1,598Kb)
Related Information
- About atomic layer deposition (ALD)
- Plasma atomic layer deposition (ALD) and its benefits
- Global Customer Support & Service - Oxford Instruments Plasma Technology
- Deposition and growth
- Etching, deposition and growth
- High brightness LEDs (HB LEDs)
- Molecular beam epitaxy (MBE)
- Nanostructure growth
- Technologies and Devices International (TDI)
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