Ionfab^®300Plus ion beam etch and deposition process tool

Ionfab®300Plus ion beam etch and deposition process tool

The Ionfab300Plus offers multiple ion beam etch and deposition capability through

• Ion beam etching/milling (IBE/IBM)
• Reactive ion beam etching (RIBE)
• Chemically-assisted IBE (CAIBE)
• Ion beam sputter deposition (IBSD)
• Ion assisted sputter deposition (IASD)
• Reactive ion beam deposition (RIBD)

for 100 mm up to 200 mm wafers, across a wide range of materials and applications.

The Ionfab300Plus system can be configured for single or dual beam etch and deposition use. Dual beam configurations offer the possibility to follow etch process steps directly by deposition steps, without exposing the process chamber or wafer to atmosphere. Most combinations of ion beam etch and deposition processes can be combined in the same system, subject to the processes themselves being compatible.

Product benefits

• Designed for flexibility in materials and processes
• High uniformity etching, offering ± 3% over 200 mm
• Based on leading 35 cm ion source and 30 cm grid set technology
• Small footprint
• Ease of maintenance ensured with door-mounting ion sources, giving minimum system/production downtime
• Multiple wafer-handling options for
• Single wafer
• Cassette loading
• Square or hexagonal cluster configuration
• Through-wall configuration
• Production proven, with a rugged industrial ion source, easy-to-service modules and backed by Oxford Instruments' global ProServe customer support network