New Copper Thickness Measurement Gauge

Oxford Instruments launches a new CMI165 Copper Thickness Measurement Gauge featuring temperature compensation. This unique hand-held device accurately measures hot or cold copper on printed circuit boards (PCBs). This temperature compensation allows for in-process inspection regardless of the temperature of the Cu surface.

The CMI165 includes Oxford Instruments proprietary SRP-T1 measurement probe tip and housing for guaranteed repeatability and reliability.  The probe tip is fully replaceable without the need for factory recalibration.  The spare probes shipped with the instrument ensure minimal factory down time.  The illuminated probe tip allows easy positioning on copper traces.  Thin etched traces are accessible without the need for line width standards. 

This versatile gauge can measure foil, laminated, electroless or electrodeposited copper thickness with direct digital readout in mils, microns or copper weight.  The CMI165 can be used to sort Cu by weight at incoming inspection, before drilling, shearing or copper plating processes.  After etching or planarizing, the thickness of the remaining Cu can easily be quantified.  The intuitive user interface is available in English and simplified Chinese. Statistical analysis includes data recording, average, standard deviation, and high-low reporting.  Data transfer is facilitated through a high speed USB 2.0 connection.  Factory calibrations and custom calibrations are possible