Etching deposition and growth

Oxford Instruments offers a range of process solutions for etching, deposition and growth of advanced materials on micro- and nanometre scales.

Our range of solutions encompasses:

• Etching
• Plasma etching
• Reactive ion etching (RIE)
• Inductively-coupled plasma (ICP) etch
• RIE/PE (plasma etch) dual mode tools for failure analysis dry etch de-processing
• Ion beam etch for a wide range of materials, many not etchable by plasma means
• Ion beam etching/milling (IBE/IBM)
• Reactive ion beam etching (RIBE)
• Chemically-assisted IBE (CAIBE)
• Deposition
• Plasma-enhanced thin film deposition
• Plasma-enhanced chemical vapour deposition (PECVD)
• Inductively-coupled plasma chemical vapour deposition (ICP-CVD), offering lower processing temperatures than PECVD
• Atomic layer deposition (ALD) for ultra-thin film deposition, with highly conformal (~100%), pinhole-free coverage of a wide range of oxides, nitrides, single element metals and nanolaminates materials
• Physical vapour deposition offering the flexibility of dc or rf magnetron sputtering for batch or single-wafer PVD processing in production or research & development
• Ion beam deposition for a wide range of materials and for ultra high-quality optical coatings (high reflectance and anti-reflectance)
• Ion beam sputter deposition (IBSD)
• Ion assisted sputter deposition (IASD)
• Reactive ion beam deposition (RIBD)
• Growth
• Molecular beam epitaxy (MBE) for the expitaxial growth of III-V, II-VI and nitride materials
• PECVD growth of nanomaterials
• carbon nanotubes (CNT)
• nanowires

Please select from the list of sub-applications within our "Product Finder" to help you locate the correct product, or choose from the list of "Related Products" in the section beneath it. Alternatively, please contact us to discuss your need, and our expert sales and applications staff will be pleased to help you select the right process and tools to meet your requirements.